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Spring 2023: Conductive Hydrogel-based Soft and Flexible Bioelectronics

Affiliations: DeBakey Executive Research Leadership Program
Project Leader: Md Saifur Rahman
msr@tamu.edu
Biomedical Engineering
Faculty Mentor: Limei Tian, Ph.D.
Meeting Times:
TBD
Team Size:
6
Open Spots: 0
Special Opportunities:
Hands on training on materials engineering, earning co-authorship on publications, opportunity to join Tian lab as graduate student
Team Needs:
Simulation, SOLIDWORKS, Matlab; familiarity with machine learning and wearable sensors preferred
Description:
Implantable electronic devices have broad applications for various disease diagnoses and treatments. Existing commercial electronic implants rely on conductive materials with high Young’s Modulus, such as gold and platinum.  Mechanical disparity across rigid electronics-tissue interfaces has been a major drawback affecting the biocompatibility of electronic implants.  Soft materials with Young’s modulus matching that of biological tissues can significantly reduce adverse immune responses and are highly desired for next-generation bioelectronics. This project will develop soft biocompatible conductive hydrogels with low modulus and high electrical conductivity.  The soft conductive hydrogels endow electronic implants with flexibility and stretchability, providing a seamless interface to soft tissues and adaptable access to large, curved surfaces for high-performance sensing and stimulation

Written by:
Andrew McNeely
Published on:
January 2, 2023

Categories: FullTags: Spring 2023

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