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Spring 2024: Hydrogel-based soft bioelectronics

Affiliations: Aggie Research Mentoring Program
Project Leader: Md Saifur Rahman
msr@tamu.edu
Biomedical Engineering
Faculty Mentor: Limei Tian, Ph.D.
Meeting Times:
TBA
Team Size:
7
Open Spots: 0
Special Opportunities:
Best peformer will be recommended for summer 2024 fellowship, Hourly-based payment (Project leader discretion), Hands on training on materials engineering, earning co-authorship on publications
Team Needs:
Function generator, Oscilloscope, available for summer 2024
Description:
Generally, bioelectronics made of electronic materials, such as metals and other rigid materials, have been used for implantable devices. Due to the mechanical mismatch between soft tissue and hard electronics, using such rigid bioelectronics results in a wall of scar tissue encapsulating implants, even though the hard electronics have excellent electrical properties. Consequently, mechanical mismatch gradually causes significant tissue damage and implant failure over time. Therefore, to reduce immune responses and maintain body movement, minimizing the mechanical discrepancy between tissue and implantable rigid electronics is crucial. However, the limited availability of the right electronic materials for configuring soft implants that simultaneously mimic soft tissue modulus and support electronic properties is highly demanded. By envisioning this, we demonstrate nontoxic additives doped poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate) (PEDOT:PSS)-based conductive hydrogel for fabricating soft implantable microelectronics.

Written by:
América Soto-Arzat
Published on:
November 16, 2023

Categories: FullTags: Spring 2024

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