| Affiliations: | Aggie Research Mentoring Program |
| Project Leader: | Md Saifur Rahman msr@tamu.edu Biomedical Engineering |
| Faculty Mentor: | Limei Tian, Ph.D. |
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Meeting Times:
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TBA |
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Team Size:
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6
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| Open Spots: | 3 |
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Special Opportunities:
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First semester hourly payment does not apply to new students. The best performer will be recommended for hourly pay in the next semester, at the project leader’s discretion, if they have not received research credit. Hands on training on materials engineering, earning co-authorship on publications based on scienetific contribution (We proudly collaborate with undergraduate trainees, sharing authorship on exciting projects. We’re committed to supporting their futures with strong recommendation letters for graduate school applications and job opportunities. Let’s achieve great things together!) https://tianlab.engr.tamu.edu/publications/
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Team Needs:
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Students from any background with knowledge of numerical simulations, such as FEM (Finite Element Method) and FEA (Finite Element Analysis), are welcome. |
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Description:
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Generally, bioelectronics made of electronic materials, such as metals and other rigid materials, have been used for implantable devices. Due to the mechanical mismatch between soft tissue and hard electronics, using such rigid bioelectronics results in a wall of scar tissue encapsulating implants, even though the hard electronics have excellent electrical properties. Consequently, mechanical mismatch gradually causes significant tissue damage and implant failure over time. Therefore, to reduce immune responses and maintain body movement, minimizing the mechanical discrepancy between tissue and implantable rigid electronics is crucial. However, the limited availability of the right electronic materials for configuring soft implants that simultaneously mimic soft tissue modulus and support electronic properties is highly demanded. By envisioning this, we demonstrate nontoxic additives doped poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate) (PEDOT:PSS)-based conductive hydrogel for fabricating soft implantable microelectronics. |